AS568-026 FFKM O-Ring — 31.47 × 1.78 mm
A compact, low-squeeze section for light-duty static and slow dynamic seals in smaller bore assemblies. With an inside diameter of 31.47 mm and a 1.78 mm cross section, this is a medium-bore seal for mid-size industrial equipment. Moulded from Aperflu 2275 perfluoroelastomer (FFKM) for continuous service up to 200 °C, this seal resists hot acids, caustics, solvents, fuels and steam.
Dimensions
| Dash number | AS568-026 |
|---|---|
| Inside diameter (ID) | 31.47 mm (1.239 in) |
| Cross section (CS) | 1.78 mm (0.07 in) |
| Outside diameter (OD) | 35.03 mm (1.379 in) |
| Material | Aperflu 2275 perfluoroelastomer (FFKM) |
| Service temperature | up to 200 °C continuous |
Semiconductor wafer processing
For non-etch, non-critical areas of semiconductor tooling — such as utility lines, cooling circuits, gas-supply fittings and general wafer handling equipment — Aperflu 2275 delivers dependable, stable sealing performance at a cost-effective price. It is not intended for plasma etch or other critical chamber duties, where dedicated high-purity grades should be selected.
Why Aperflu 2275 FFKM
The compound is moulded, de-flashed and inspected to a burr-free finish, and every batch ships with its own certificate of analysis for traceability.
Typical applications
Pneumatic fittings, low-pressure hydraulic circuits, valve stems and quick-connect couplings, where Aperflu 2275 outperforms FKM and EPDM in aggressive media and elevated temperature.
Compound properties
| Property | Typical value | Test method |
|---|---|---|
| Hardness | 70 – 71 Shore A | GB/T 39693.4 |
| Tensile strength | 21.2 – 21.8 MPa | GB/T 528 (dumbbell type 2) |
| Elongation at break | 155 – 170 % | GB/T 528 (dumbbell type 2) |
| Compression set, 200 °C × 70 h (25 %, method B) | 15 – 16 % | GB/T 7759.1 |
All values are typical. Every batch is shipped with an individual certificate of analysis and may differ from the typical values listed here.
Chemical resistance
The fully fluorinated backbone of Aperflu 2275 resists the aggressive media that attack FKM, EPDM and silicone — including concentrated hydrochloric, nitric, sulfuric and glacial acetic acids, strong caustics, and a broad range of solvents and fuels. Refer to the rating table below for guidance, and confirm your exact media with our engineers.
| Media group | Rating |
|---|---|
| Hydrochloric acid | Excellent |
| Nitric acid | Excellent |
| Sulfuric acid | Excellent |
| Acetic acid (glacial) | Excellent |
| Other hot organic & inorganic acids | Excellent |
| Caustics (ammonia, NaOH up to 50 %) | Excellent |
| Ketones, aldehydes, esters, ethers, alcohols | Excellent |
| Solvents, fuels, hydrocarbons, sour gases | Excellent |
| Steam and hot water | Excellent |
| Ethylene diamine & high-temp amines | Good – contact us for grade selection |
| Clean-in-place (CIP) / steam-in-place (SIP) agents | Excellent |
| Active pharmaceutical ingredients (APIs) | Excellent |
Ratings are typical for peroxide-cured FFKM compounds at room and elevated temperature. Final suitability depends on concentration, temperature and pressure — contact us for a compound recommendation against your specific media.
More AS568 1.78 mm cross-section sizes
Need AS568-026 in a custom colour or quantity?
Tell us your dash number, quantity and service media. We quote within 24 hours.
Request a Quote